Cisco Systems has introduced the Silicon One G300 networking chip, engineered to address the surging data demands of AI workloads. Offering an impressive 102.4 terabits per second (Tbps) of bandwidth, it aims to reduce data center bottlenecks. "We are still in the early innings of AI buildouts," stated Nick Kucharewski, Senior VP at Cisco. The G300 features liquid cooling for improved energy efficiency and is set for commercial availability in late 2026.
Cisco Systems has introduced the Silicon One G300 networking chip, engineered to address the surging data demands of AI workloads. Offering an impressive 102.4 terabits per second (Tbps) of bandwidth, it aims to reduce data center bottlenecks. "We are still in the early innings of AI buildouts," stated Nick Kucharewski, Senior VP at Cisco. The G300 features liquid cooling for improved energy efficiency and is set for commercial availability in late 2026.