Meta's research scientist Tony Wu discussed the challenges of designing augmented reality (AR) systems at the IEEE International Solid State Circuits Conference. He emphasized the need for lightweight, low-heat, and power-efficient AR devices. Meta's prototype AR processor, Aria, employs 3D chip integration technology for compactness and energy efficiency. The chip, composed of two ICs bonded face-to-face, utilizes through-silicon vias for signal and power connections. This technology allows for increased computing power without enlarging the chip's size. In testing, the chip demonstrated improved energy efficiency and processing speed compared to single-die alternatives, particularly in hand tracking for AR applications. Additionally, the 3D chip enables full HD image processing at the same energy consumption level as compressed images processed by 2D chips.