Huawei Technologies launches its SuperPod technology, enabling the connection of up to 15,488 graphic cards with Ascend AI chips, aiming to compete with Nvidia. The company also introduced a new AI chip lineup, including the Ascend 950PR in early 2026, Ascend 950DT in late 2026, Ascend 960 in 2027, and Ascend 970 by 2028. Founder Ren Zhengfei emphasized cluster-based computing to offset individual chip limitations, indicating a strategic move to enhance competitiveness.