Huawei Technologies launches its SuperPod technology, enabling the connection of up to 15,488 graphic cards with Ascend AI chips, aiming to compete with Nvidia. The company also introduced a new AI chip lineup, including the Ascend 950PR in early 2026, Ascend 950DT in late 2026, Ascend 960 in 2027, and Ascend 970 by 2028. Founder Ren Zhengfei emphasized cluster-based computing to offset individual chip limitations, indicating a strategic move to enhance competitiveness.
Huawei Technologies launches its SuperPod technology, enabling the connection of up to 15,488 graphic cards with Ascend AI chips, aiming to compete with Nvidia. The company also introduced a new AI chip lineup, including the Ascend 950PR in early 2026, Ascend 950DT in late 2026, Ascend 960 in 2027, and Ascend 970 by 2028. Founder Ren Zhengfei emphasized cluster-based computing to offset individual chip limitations, indicating a strategic move to enhance competitiveness.