xMEMS Labs is set to disrupt the audio industry with its groundbreaking Cypress ultrasonic solid-state speaker technology, to be unveiled at CES 2024. This innovation, utilizing microelectromechanical systems (MEMS), is a monolithic silicon piece manufactured like a chip, promising 140dB full-range audio for personal devices. In collaboration with TSMC, known for producing Apple chips, Cypress offers micro-level precision, scalability, and uniformity. Boasting 25 patented technologies, the speaker integrates actuation and diaphragm in a single unit, delivering unprecedented features like high-resolution audio, Dolby Atmos, and active noise cancellation. The ultrasonic modulation ensures rich, detailed sound, challenging traditional coil-based speakers with advantages such as 1-degree spatial accuracy, faster transient response, and enhanced clarity. The speaker's smaller footprint allows for more compact and longer-lasting earbuds.